Now Raising — Phase 1 Capital Round

Packaging
Australia's
Digital Future.

Axonic Semiconductor is building Australia's first sovereign Outsourced Semiconductor Assembly and Test (OSAT) facility in Melbourne, Victoria. The missing piece of Australia's sovereign AI supply chain.

Request Investor Deck → Why Axonic
ZERO
OSAT Facilities
in Australia
$700B+
Global Semiconductor
Market
$46.5B
Global OSAT
Market 2025
50–80
Victorian Jobs
Phase 1

Australia has zero semiconductor packaging facilities.

Every chip powering Australia's defence systems, data centres, hospitals and critical infrastructure is packaged offshore — through supply chains we do not own, control or audit.

Firmus Technologies is deploying 54,000+ Nvidia GPUs across Melbourne and Tasmania under Project Southgate — a $73B sovereign AI infrastructure investment. Every one of those chips arrives packaged from Asia.

That is not sovereign AI. That is sovereign compute on foreign supply chains. Axonic Semiconductor fixes this.

Defence & AUKUS risk — classified chip designs leave Australia for packaging. AUKUS Pillar 2 demands sovereign advanced manufacturing. No facility exists.
AI infrastructure gap — $73B of AI compute is being deployed in Australia. The packaging layer that makes it sovereign does not exist.
Fabless industry stranded — Morse Micro, BrainChip, Silicon Quantum Computing design world-class chips in Australia. All packaged offshore.
Geopolitical exposure — 95% of advanced semiconductor packaging is concentrated in Taiwan, Malaysia and China. A disruption stops Australia cold.

Phase 1 Technology Stack

Commercial OSAT services using proven, bankable processes — designed for sovereign auditability and DISP accreditation from day one.

Axonic Semiconductor is purpose-built for the AI compute era — with sovereign auditability, chain-of-custody at every process step, and cleared operations designed for DISP accreditation from day one.
Wire Bond Packaging
Gold and copper wire bond for standard and high-reliability packages. K&S and ASMPT platforms.
Flip Chip Assembly
Controlled collapse chip connection for high-density, high-performance devices.
Die Attach
Epoxy and eutectic die attach for standard and high-power applications. Besi platform.
Failure Analysis
SEM, FIB, C-SAM, X-Ray and optical analysis. Counterfeit detection. Secure chain of custody documentation. DISP accreditation pathway in progress.
Electrical Test
Functional and parametric test. Teradyne and Advantest platforms. Burn-in capability.
X-Ray & Inspection
2D and 3D X-Ray, scanning acoustic microscopy (C-SAM). JEDEC and MIL-STD compliant.
Phase 2 Advanced Packaging — From 2029
Fan-Out Wafer Level Packaging (FO-WLP) · 2.5D Interposer · System in Package (SiP) · Through-Silicon Via (TSV) · Chiplet Integration

Built for Australia's Most Critical Industries

We serve customers who cannot afford supply chain risk — because the systems their chips power are too important to fail.

🛡
Defence & AUKUS
DISP-accredited facility for Australian defence agencies, prime contractors and AUKUS programme participants requiring sovereign chip packaging.
Data Centres & Hyperscalers
Sovereign packaging for AI compute infrastructure operators deploying at scale in Australia who require local, auditable supply chains.
🔬
Medical Devices
ISO 13485-aligned operations for Australian medical technology manufacturers requiring implantable and life-critical device packaging.
🛰
Space & Satellites
Radiation-tolerant packaging for Australia's growing space economy — MIL-STD compliant, chain-of-custody controlled.
🔗
Critical Infrastructure
Sovereign packaging for telecommunications, power, water and national infrastructure operators who cannot tolerate offshore supply chain risk.
💡
Australian Fabless Designers
Local packaging for Australian-designed chips for the first time — enabling a sovereign end-to-end semiconductor supply chain on home soil.

We are raising Phase 1 capital.

Australia has never had a semiconductor packaging facility. We are building the first one — and we are raising the capital to make it happen.

If you are a deep tech investor, strategic partner or sovereign capital provider who understands what this moment means for Australia — we want to talk.

$15–25M
Phase 1 Capital Target
50–80
Victorian Jobs Created
$46.5B
Global OSAT Market 2025

Sovereign by Design. Not by Declaration.

Security by Architecture
Founded by a senior enterprise security architect with active Australian government security clearance. Sovereign auditability is our foundation — not a feature added for compliance. Zero-trust principles applied to physical semiconductor manufacturing.
DISP Accreditation Pathway
DISP (Defence Industry Security Programme) accreditation in progress. The only pathway to packaging classified defence chips on Australian soil. Required for AUKUS Pillar 2 supply chain participation.
Five Eyes Aligned
Australia is the only Five Eyes nation with zero semiconductor packaging capability. Axonic Semiconductor closes this gap — creating a western-aligned, auditable OSAT node for allied nation defence programmes.
Chain of Custody
Every wafer, every die, every packaged unit tracked with full chain-of-custody documentation. MES-integrated, tamper-evident, auditable by customers and regulators. The zero-trust approach applied to physical manufacturing.
Ecosystem Anchor
Axonic Semiconductor anchors Australia's first end-to-end semiconductor ecosystem — connecting Australian chip designers to a local packaging facility for the first time in history. Victorian manufacturing, Australian supply chain.
Strategic Partnerships
Strategic OSAT partnership discussions underway with Asian tier-2 OSAT operators for technology licence and operational expertise. Active engagement with Semiconductor Australia (S3B) ecosystem and Australian university research programmes.
Shantanuu Roy
Founder & CEO — Axonic Semiconductor

I spent nearly two decades building sovereign infrastructure for Australia's most critical institutions. That work taught me one thing above all else: sovereignty is not declared — it is built, process by process, at the physical layer.

Axonic Semiconductor is that physical layer. The one Australia has never had. The one it cannot afford to go without.

Melbourne-based. Fully committed. Building this for the next 100 years.

The Mission
Australia has never had a semiconductor packaging facility. Axonic Semiconductor is building the first one — purpose-designed for the sovereign AI era.
The Advantage
A security architect who spent two decades protecting critical national infrastructure is uniquely positioned to build sovereign semiconductor manufacturing. The discipline is the same. The stakes are the same.
The Timing
$73 billion of AI compute infrastructure is being deployed in Australia right now. Every chip arrives packaged from Asia. The window to build sovereign packaging capability is open — and closing.
The Commitment
Melbourne-based. Fully committed. Building Axonic Semiconductor for the next 100 years.

Ready to Back Australia's First Sovereign OSAT?

We are raising $15–25M to establish Australia's first sovereign OSAT facility. If you are an investor, strategic partner or government body who wants to be part of this — request our investor deck or book a call directly.

Book A Call
Schedule a 30-minute call with Shantanuu directly to discuss the investment opportunity.
Book 30-Min Call →
Location
Melbourne, Victoria, Australia 🇦🇺
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Downloads
→ Company One-Pager (PDF) → Investor Information Package
Axonic AI Pty Ltd | ACN 694 833 871
Trading as Axonic Semiconductor
Melbourne, Victoria, Australia